Hebei Ruisite Precision Technology Co.,Ltd is a professional manufacturer of surface finishing machines such as electro-plating, electroless plating, galvanizing etc.We provide OEM production and one-stop service from technological design, production line layout, manufacturing, delivery, installation, commissioning and after-sales service.
Author: Anna
Copper plating is a process of plating a copper layer on the surface of a material, and there are mainly the following types:
I. Electroplated copper
Principle:
Using the principle of electrolysis, copper ions are deposited onto the surface of the workpiece to be plated from a copper-containing plating solution. Plating solution usually contains copper salts (such as copper sulfate), conductive salts, buffers and other components. Under the action of direct current, the copper atoms at the anode lose electrons and become copper ions into the plating solution, while the surface of the workpiece to be plated at the cathode attracts copper ions to obtain electrons to be reduced to copper atoms and deposited to form a copper layer.
Application Scenario:
Electronic industry: Used in the manufacture of printed circuit boards (PCB). Copper plating on PCBs creates electrically conductive circuits and ensures the electrical connection between electronic components. For example, the inner and outer layers of a multi-layer PCB need to be plated with copper to build fine circuit patterns for high-speed, stable signal transmission.
Hardware products: such as faucets, door handles, metal jewelry, etc.. Copper plating can improve the appearance of the product decorative, so that it has a similar bronze-colored texture, and at the same time to enhance the surface wear resistance and corrosion resistance, to extend the service life of the product.
Automobile parts: some automobile decorative parts, radiator and other parts will use copper plating process. Copper plating can give these parts a good appearance and corrosion resistance to adapt to the use of the car in a variety of complex environments.
II. Chemical copper plating
Principle:
The use of chemical reactions, through the reducing agent will be in solution in the reduction of copper ions into metallic copper and deposited on the surface of the workpiece. Usually use formaldehyde, sodium hypophosphite and so on as the reducing agent, in a certain temperature and pH value conditions, the reducing agent will reduce copper ions to copper atoms and deposited in the catalytic activity of the surface of the workpiece, the formation of uniform copper plating layer.
Application Scenario:
Plastic plating: For some plastic products, such as automobile interior parts, electronic product shells, etc., due to the plastic itself is not conductive, it is necessary to carry out chemical copper plating to make the surface conductive, and then subsequent plating and other processes can be carried out. Chemical copper plating can form a uniform, dense conductive copper layer on the surface of the plastic, for the subsequent plating of other metals to provide the basis.
Printed Circuit Board Manufacturing: Chemical copper plating is one of the key steps in the metallization of PCB holes. It deposits a uniform copper layer on the hole wall, realizing the electrical connection between the various layers of circuitry and ensuring the reliability and performance of the PCB.
Microelectronics: In the process of semiconductor chip manufacturing and packaging, chemical copper plating is used to make the interconnection structure of the chip and the circuit on the packaging substrate. It can meet the requirements of microelectronic devices for high precision, high reliability and miniaturization.
III. Vacuum copper plating
Principle:
In a vacuum environment, copper materials are evaporated or sputtered into an atomic or ionic state by heating or ion bombardment, etc., and then these copper particles are deposited on the surface of the workpiece to form a copper layer. Vacuum copper plating usually needs to be carried out in high vacuum equipment to avoid the interference of gas molecules on the plating process.
Application Scenario:
Optical products: such as eyeglass lenses, reflectors for optical instruments, etc. Vacuum copper plating can form a specific thickness of copper film on the surface of the lens, which can be used to adjust the optical performance, increase the reflectivity or realize special optical effects.
Decorative coating: Vacuum copper plating is used for the surface decoration of some high-grade handicrafts and gifts. It can give the product a unique metallic texture and luster, and enhance the grade and artistic value of the product.